Devices ・ Infrastructure・Industries:Powering Enterprise AI
As generative AI moves from proof of concept into core enterprise workflows, industry decision-makers are shifting their focus from “where AI is headed” to “how to deploy it now, how to invest wisely, and how to manage cost.” Enterprise-grade AI infrastructure is becoming the foundation for industrial AI adoption. The next critical challenge is finding the right balance across cloud, private deployment, and edge computing—while optimizing cost, performance, data security, and operational flexibility.
From AI servers, GPUs and NPUs, CPO, and high-speed networking to power conversion, thermal management, energy efficiency, and edge deployment, AI infrastructure is redefining value creation across the electronics supply chain. As carbon pricing mechanisms and CBAM reshape global supply chain requirements, enterprise competitiveness is expanding beyond computing performance to include energy efficiency and operational resilience.
The 2026 TAITRONICS & AIoT Taiwan Forum will center on “Devices・Infrastructure・Industries: Powering Enterprise AI.” The forum will focus on two core themes: “The Infrastructure Race Behind Enterprise AI Compute” and “From Electronics Hardware to Real-World AI Deployment.” Bringing together global technology leaders and industry experts, the forum will examine the critical path from compute buildout and infrastructure deployment to energy efficiency and cost governance—helping enterprises move AI from investment decisions to practical implementation, while addressing the most urgent challenges facing today’s electronics industry.
❚ Agenda 2026.10.21 (Wed.) 10:00-16:05
【Morning Session】Session 1|Infrastructure Readiness
From endpoint devices to edge architectures, the morning session examines the next wave of technology restructuring across the electronics value chain.
Through global trends, key technologies, and supply chain perspectives, it explores embedded systems, endpoint devices, AI compute modules, sensors, and next-generation communications—highlighting the foundational requirements for enterprise AI infrastructure.
| 10:00-10:30 | Morning Session Register | |
| 10:30-10:35 | Opening Remarks | TAITRA Representative |
| 10:35-10:40 | Group Photo | |
| 10:40-11:00 | Edge Intelligence in Action: Redefining Enterprise AI Deployment Architecture | Nakul Duggal|EVP and Group GM, Automotive, Industrial and Embedded IoT, and Robotics, Qualcomm (invitation) |
| 11:00-11:20 | Physical AI at Work: Bringing AI from Models to Machines | Ethan Chen|General Manager, Edge Computing Platform Business Unit, ADLINK Technology Inc.(invitation) |
| 11:20-11:40 | From Terrestrial Networks to LEO: Completing the Last Mile of Next-Generation Connectivity | Daniel Chang|Chairman, Auden Techno Corp.(invitation) |
| 11:40-12:00 | The AI Compute Challenge: Power, Cooling, and Energy Efficiency as the Next Infrastructure Battleground | Ares Chen|Vice President and General Manager, Power and System Business Group, Delta Electronics |
【Afternoon Session】Session 2|Deployment in Action
From systems and semiconductors to power infrastructure and optical connectivity, the afternoon session examines the electronics hardware that enables enterprise AI compute.
Building on the morning session’s discussion of infrastructure readiness, it explores server system integration, semiconductors, advanced packaging, power and cooling, and optical networking—showing how enterprises can bring AI compute to edge devices and real-world operations.
| 13:30-14:00 | Afternoon Session Registration | |
| 14:00-14:05 | Afternoon Speaker Group Photo | |
| 14:05-14:35 | AI Compute on the Factory Floor: From Server Systems to Scaled Deployment | Clement Lin|Chairman, NEXCOM International Co., Ltd.(invitation) |
| 14:35-15:05 | Beyond GPUs: Optoelectronic Semiconductors for Next-Generation AI Computing | Dr. Hao-Chung Kuo|Director, Semiconductor Research Center, Hon Hai Research Institute |
| 15:05-15:35 | Powering the AI Factory: Intelligent Power and Low-Carbon Facility Upgrades | Dr. Da-Jeng Yao|CTO, TECO Electrics and Machinery Co., Ltd |
| 15:35-16:05 | All-Photonics Network: Enabling Cost-Effective and Manageable Enterprise AI Compute | HONG-REN LO |Managing Director, Cloud Computing Laboratory, Telecommunication Laboratories, Chunghwa Telecom |
*The organizer reserves the right to adjust the agenda content.




